Believe it or not, this is an equipment breakdown
A speck of dust straddling two electrical circuits on a computer chip
A fractured silicon wafer
This silicon wafer serves as a base for microelectronics built in and upon the wafer. The fractures or cracks can be seen in the upper right of the image.
During manufacture, silicon wafer preparation and handling can result in damage in the form of micro-cracks at the edges of the wafers.
While the damage may initially be harmless, under some conditions, such as increased temperatures, the micro-crack may later increase dramatically, finally cutting the wafer into pieces, resulting in failure of the circuit, and causing the equipment to stop working.
Technology is now the size of DNA
Today, more than 100 million transistors could fit on the head of a pin. These transistors are so small, just 22 nanometers, that you could fit 4,000 of them across the width of a human hair.
A strand of human DNA is 2.5 nanometers in diameter. We are dealing with technology that is only a little larger than DNA.
Physical damage to microelectronics is way too small to be seen
Most equipment breakdown policies require visual evidence of physical damage for coverage to apply. This is where a specialist insurer, like HSB, can help.
HSB Machinery and Technology Insurance
Our solution responds to changing equipment risks and exposures, providing an equipment breakdown, deterioration of stock, and business interruption policy all in one. Comprehensive cover for businesses operating machinery and equipment.
Customers don't have to prove physical damage to microelectronics. Coverage applies if replacing the part containing electronic circuitry (such as a circuit board), or the entire equipment, restores functionality.