Believe it or not, this is an equipment breakdown
The image below shows a speck of dust straddling two electrical circuits on a computer chip:
This is a fractured silicon wafer:
This silicon wafer serves as a base for microelectronics built in and upon the wafer. The fractures or cracks can be seen in the upper right of the image.
During manufacture, silicon wafer preparation and handling can result in damage in the form of micro-cracks at the edges of the wafers.
While the damage may initially be harmless, under some conditions, such as increased temperatures, the micro-crack may later increase dramatically, finally cutting the wafer into pieces, resulting in failure of the circuit, and causing the equipment to stop working.
Technology is now the size of DNA:
Today, more than 100 million transistors could fit on the head of a pin. These transistors are so small, just 22 nanometers, that you could fit 4,000 of them across the width of a human hair.
A strand of human DNA is 2.5 nanometers in diameter. We are dealing with technology that is only a little larger than DNA.
Physical damage to microelectronics is way too small to be seen.
Every business depends on microscopic technology that’s getting more complex every day. And it’s not just computers: Boilers, furnaces, air conditioners, diagnostic equipment, CNC, and retail point-of-sale systems are all prone to microelectronic damage.
Most equipment breakdown policies require visual evidence of physical damage for coverage to apply.
But HSB's TechAdvantage® redefines equipment breakdown coverage.
When it comes to microelectronics, customers no longer have to prove physical damage. Coverage now applies if replacing that part containing electronic circuitry (such as a circuit board), or the entire equipment, restores functionality.
For more information about TechAdvantage® click here, or contact your HSB representative.